Deguang Laser configures equipment and process parameters according to mica type, thickness and part structure for profile cutting, complex contours, holes, slots and surface marking.

CAD and DXF files can be imported directly without producing a cutting die. This supports rapid sampling and batch production of insulating gaskets, battery thermal barriers, electrical insulation sheets and non-standard parts.

Complex profiles and dense hole patterns can be completed continuously along the design path, reducing manual positioning. Because composite structures vary, material sampling should be completed before production to establish power, speed and the required number of passes.

The final configuration is selected around material construction, thickness, edge-quality requirements and expected throughput.